Board for IC card having component mounting recess

ABSTRACT

A board for an IC card includes a main body in the shape of a plate. A recess is formed in the main body for receiving and adhering a component therein. The recess includes a bottom wall integrated as one body with the main body, and an adhesion section for adhering the component. A wall of the adhesion section is an uneven surface. Ribs may be provided which extend from an inner side of the recess to contact the component.

This application is a divisional of copending application Ser. No.08/505,447, filed on Jul. 21, 1995, now U.S. Pat. No. 5,725,819 entirecontents of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a board for an IC card for mounting anintegrated circuit chip or the like.

2. Description of the Prior Art

An IC (integrated circuit) card comprises a board on which electronicscomponents such as an IC chip of a memory device or a microprocessor aremounted. A board provided for producing an IC card may have one or morerecesses on a plane thereof for mounting components. A board may beproduced by injection molding. For example, after the components arefixed to the recess, resin is filled into the recesses to seal thecomponents.

Such a board is described for example in Japanese Patent laid openPublication 62-298143/1987. In the production of the board, a plasticplate of a prescribed thickness is punched with a press to produce acard blank. Then, recesses for mounting components are cut in the blankprecisely by a numerical control machine, to provide the board. However,the board produced as described above has a high production cost, and itis hard to reduce the cost even by mass production.

If the board is formed with injection molding with a plastics materialat the same time as the recesses for mounting the components as anintegral body, the production cost can be reduced largely. However, thethickness of the board is about 0.8 mm. Therefore, if the recesses areformed at the same time, the thickness at the bottom wall of therecesses becomes very thin, or the bottom walls cannot be formed surely.Therefore, cutting is adopted at present than injection molding.

However, if cutting is adopted, when an integrated circuit chip isfitted to the recess for adhesion, a portion of the recess to be adheredhas a relatively smooth surface due to precise cutting. Therefore, whenan IC card is subjected to a strong shock or when a card is bent, a partof adhesion plane is liable to be separated. In order to prevent theseparation, the walls may be remained to have rough surfaces to increaseadhesion strength. However, in such a case, precision along depthdirection is liable to have a scattering, and precision of positions ofconnection terminals of integrated circuit chips cannot be maintained.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a manufacturing methodof a board for an IC card, the board having a recess with a film-likewall at the bottom of the recess, the board made by a method being ableto mass-produce the board to reduce a production a cost to a largedegree.

Another object of the present invention is to provide a board for an ICcard made by a method which can form a film-like wall surely withoutincreasing injection pressure while improving mechanical strength andheat resistance.

A third object of the present invention is to provide of a board for anIC card made by a method which can form the board without strain due toforming.

A fourth object of the present invention is to provide a board for an ICcard made by a method which can remove a gate during the forming so thatremoval of the gate after separating the mold is not needed to reduce aproduction cost of the board.

A fifth object of the present invention is to provide a board for an ICcard, the board itself or a bottom wall thereof having a sufficientmechanical strength to improve endurance.

A sixth object of the present invention is to provide a board for an ICcard having no strain due to forming, no deformation due to heat andsuperior on heat resistance.

A seventh object of the present invention is to provide a board for anIC card wherein a component such as an IC chip can be adhered and fixedstrongly to a recess so-that the component is not removed when anabnormal strength of bending and shock exerts to the board or theendurance is good.

In one aspect of the invention, a board for an IC card is manufactured.The board has a recess for receiving a component such as an integratedcircuit chip in one of the planes of the board, and the recess has afilm-like wall integrated as one body with the board at an inner bottomof the recess. In the method, (a) a slide core is provided in a mold forinjection molding for forming the board, the slide core 15 facing acavity 12 in the mold. (b) Then, molten resin is injected into thecavity, and the slide core is moved into the cavity to a formingposition before the resin began to solidify. Thus, the recess and thefilm-like wall can be formed at the same time surely.

In a second aspect of the invention, a board for an IC card, comprises arecess for receiving a component such as an integrated circuit chip inone of the planes of the board, the recess having a film-like wallintegrated as one body with the board at an inner bottom of the recess.The board is made of a plastic material by using injection molding, andthe recess and the film-like wall are made with a slide core projectinginto a cavity with injected molten resin.

In a third aspect of the invention, a board for an IC card comprises arecess for receiving and adhering a component such as an integratedcircuit chip in one of the planes of the board produced by injectionmolding, and the recess has a film-like wall integrated as one body withthe board at an inner bottom of the recess. The board comprises anadhesion wall for adhering the component for fixing it, the adhesionwall having an uneven surface.

It is an advantage of the invention that a film-like wall at the bottomof the recess can be formed surely in a board for an IC card.

It is another advantage of the invention is that a board for an IC cardcan be mass-produced.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other objects and features of the present invention willbecome clear from the following description taken in conjunction withthe preferred embodiments thereof with reference to the accompanyingdrawings, and in which:

FIG. 1 is a plan view of a board of an IC card;

FIG. 2 is a sectional view along 2—2 line in FIG. 1;

FIGS. 3A and 3B are sectional views of a mold for injection molding;

FIGS. 4A-4E are schematic sectional views of a mold for explaining stepsfor producing the board;

FIG. 5 is a plan view of the board of the plate on which components aremounted;

FIG. 6 is a sectional view along 6—6 line in FIG. 5;

FIG. 7 is a perspective, partially exploded view of the board forillustrating adhesion to the recess;

FIGS. 8A, 8B and 8C are plan views of boards having various examples ofthe recesses for mounting;

FIG. 9 is a plan view of a board having ribs for fixing componentstemporarily in recesses;

FIG. 10 is a side view of a modified example of the board of the plate;

FIGS. 11A, 11B and 11C are plan views of various examples of the boardof the plate;

FIG. 12 is a plan view of another embodiment of the board of the plate;and

FIG. 13 is a plan view of a different embodiment of the board of theplate.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring now to the drawings, wherein like reference charactersdesignate like or corresponding parts throughout the views, embodimentsof the invention are explained. A board for an IC card has a recess forreceiving a component such as an integrated circuit chip in one of theplanes of the board, and the recess has a film-like wall integrated asone body with the board provided at the bottom of the recess. The boardis made of a plastics material by injection molding.

In injection molding where resin is filled into a narrow cavity in amold, it is proposed that fluidity of molten resin is improved orinjection pressure is increased (refer to Japanese Patent laid openPublication 62202373/1987). However, if this technique is applied toproduction of a board for an IC card, the inventors found that thebottom wall at the recesses for mounting components cannot be formedsurely. If injection pressure is increased, though the bottom wall canbe formed, weld lines are formed at the surfaces thereof. Such a bottomwall do not have a sufficient mechanical strength, and when an externalforce is applied to the bottom wall, the component mounted to the recesscannot be protected enough. Further, an increase in injection pressurealso increases wear of an injection mold.

FIG. 1 shows a board of an IC card schematically, and FIG. 2 is asectional view along 2—2 line in FIG. 1. The board 1 has a square shape,and it has a recess 3 on a plane thereof for mounting a component 2 suchas an integrated circuit chip at left or right side thereof at about thecenter. The recess 3 comprises a first square recess 5 for mounting abase 2 a (not shown) of the component 2. Further, a second hole 5smaller than the first one 4 is provided at the bottom of the first one4 like a terrace structure. The inner bottom of the recess 3 or of thesecond hole 5 comprises a bottom wall 6 which is formed as an integralbody continuous to a main body of the board 1 with injection moldingusing a plastics material. The bottom wall 6 is thin like a film.Further in FIGS. 2 and 6, the sizes of the recess 3 is exaggerated alongvertical direction.

The longer side S1 of the main body of the board 1 has a length L1, andthe shorter side S2 of the main body of the board 1 has a length L2, asshown in FIG. 1. The area A1of the main body of the board 1 is equal tothe length L1 of the longer side S1 multiplied by the length L2 of theshorter side S2. Stated as an equation, A 1 =L1×L2. Also, as shown inFIG. 2, the main body of the board 1 has a thickness T, and the bottomwall 6 of the recess 3 has a thickness T1.

The board 1 has a size of a longer side of 85.6 mm, a shorter side of 54mm and a thickness T of 0.80 mm. Longer and shorter sides of the firsthole 5 are 12 mm and 10.6 mm, respectively. A thickness T1 of the bottomwall 6 is 0.22 mm. A resin material for the board 1 may be an ordinaryresin for injection molding such as vinyl chloride, vinyl acetate orABS.

FIGS. 3A and 3B show a mold for injection molding for producing theboard 1. The mold is made of a fixed mold 10 and a movable mold 11. Acavity 12 or a space for forming is formed between contact planes of themold. A spool (not shown) for supplying molten resin under pressure isprovided for the fixed mold 10, and a runner 13 connects the spool witheach cavity 12 at a narrow gate space 14. Molten resin is injectedthrough the runner 13 and the gate 14. As shown in FIG. 1, the gatespace 14 is provided at a longer side of the board near the recess 3 formounting a component, by avoiding longer and shorter sides S1 and S2 ofthe IC card.

A slide core 15 is provided at the movable mold 11 for forming therecess 4 of the board 1. The slide core 15 comprises a circular pin, andit has a top forming section 15 a having a shape in correspondence tothe recess 3 for mounting. The slide core 15 slides perpendicularly tocontact planes of a pair of the two molds 10 and 11 to reciprocatebetween a retracted position where almost all the forming section 15 amoves out of the cavity 12 and a forming position where the formingsection 15 a moves into the cavity 12. When the molds 10 and 11 aredissociated after injection, the slide core 15 moves across the formingposition.

Further, a gate pin 16 is provided to connect or disconnect the gatespace 14 to each cavity 12. A partition wall 16 a is provided at a topportion of the gate pin 16, and it can move to reciprocate between afirst position where the cavity 12 is blocked at the gate space 14 and asecond position where the partition wall 16 a is withdrawn from the gatespace 14.

The board 1 is produced with use of the molds 10, 11 explained aboveaccording to processes described in FIGS. 4A-4E.

(1) First, the slide core 15 and the gate pin 16 are located at theretracted positions, and the molds 10 and 11 are fixed (FIG. 4A). Thetop portion 15 b of the slide core 15 protrudes a little from an openingof a core hole connecting to the cavity 12 (refer to a state shown as aphantom line in FIG. 3A). Thus, a sufficient space can be providedbetween the top portion 15 b and an opposing wall of the cavity 12, sothat molten resin can flow with no difficulty to a portion for formingthe recess 3.

(2) Next, molten resin is injected through the runner 13 and the gatespace 14 into the cavity 12. Because resin flows smoothly into thecavity 12, it is prevented for a flow line around the slide core 15 tobe generated in the cavity 12. This means that a strain due todeformation does not happen within the cavity 12. The slide core 15 inthe retracted position may project a little into the cavity 12 as longas it does not hinder the flow or the resin.

After the resin fills the cavity 12, the slide core 15 is moved into theforming position to push aside the resin from an occupied area (FIG.4B). Because a bottom wall 6 is formed by moving the slide core 15 intothe forming position after resin is filled, insufficient injection ofresin or defective portions such as weld lines do not occur. In otherwords, the bottom wall can be formed surely by injection molding. Inthis step, the board 1 having the bottom wall 6 can be formed surelywithout increasing injection pressure.

The timing of the movement of the slide core 15 to the forming positionmay be at any point after the molten resin is injected and until themolten resin solidifies. However, the earliest timing is a time when themolten resin arrives to a portion for forming the film-like resin 6. Ifthe slide core 15 is located to the forming position before the moltenresin arrives to a portion for forming the bottom wall 6, it isnecessary to fill the molten resin at a higher injection pressure. Anappropriate timing is after the molten resin fills the cavity and untilthe injection pressure is kept constant.

(3) Next, while the injection pressure is kept the same, the gate pin 16is moved into the gate space 14 to seal the cavity 12 (FIG. 4C). Thus,the gate 14 is cut off from the resin in the cavity 12 during themanufacturing process. The gate space 14 is formed at a peripheryadjacent to the recess 3 because molten resin flows surely to portionsfor forming the recess 3 and the bottom wall 6, especially to preventdefectives due to forming at the bottom wall 6. It is not needed toremove the gate space 14 after separating the molds 10, 11.

(4) Next, in the state described above, the molds 10 and 11 are cooledto solidify the resin filled in the cavity 12. After a prescribedsolidification time elapses, the slide core 15 and the gate pin 16 aremoved back to the retracted positions thereof (FIG. 4D).

(5) Next, the movable mold 11 is located at a position to be separatedfrom the fixed mold 12, and the molds are opened or the movable mold 10is removed. In this state, the slide core 15 is moved again into thecavity 12 to separate the board 1 from the movable mold 11 to be takenout from the machine (FIG. 4E). Thus, it can be prevented to form aremain of the knockout pin at a wall of the board 1. The runner 13 isseparated from a knockout pin used exclusively for the separation.

By repeating the above-mentioned processes, boards 1 having bottom walls6 shown in FIGS. 1 and 2 can be mass-produced.

Because the slide core 15 is moved after resin is injected, the board 1can be formed without a strain due to forming. Therefore, the board 1has a superior mechanical strength as a whole, and it can also preventbending due to heat. That is, the board 1 had good endurance.

As shown in FIG. 6, a component 2 such as an IC chip is mounted in therecess 3 of the board 1 produced as explained above, with connectionterminals 8 thereof exposed above a plane of the board 1. As shown inFIG. 5, the number of the connection terminals 8 is eight in thisexample.

Next, the component 2 is fixed with an adhesive to an adhesion wall 7 ofthe first hole 4. The adhesion wall 7 means an area at the bottom of thefirst hole 4 except the area where the second hole 5 is formed. Theadhesive is coated beforehand only on the adhesion wall 7. As shown inFIG. 7, the adhesion wall 7 of the first hole 4 is formed to have anuneven plane such as a rough surface or a plane having a shape of wave,protrusion, saw-teeth or comb in order to fix the component 2 stronglyto the recess 3. By coating an appropriate amount of adhesive to theadhesion wall 7, a base 2 a of the component 2 is adhered and fixed tothe adhesion wall 7. Because the adhesion wall 7 is uneven, adhesionstrength increases due to a surface area thereof. Further, the precisionof the position along thickness direction of the component 2 does notscatter because the uneven surface for adhesion has generally the samedepth. The uneven surface may be formed as the adhesion wall 7 oninjection molding.

Then, printing is performed on the front and back planes of the board 1,and a protection film is laminated on the board 1 to complete an ICcard. If necessary, as shown in FIG. 1, a magnetic stripe 18 is formedat the back or front side of the board 1 to record magnetic signals.

As shown in FIG. 2 with a phantom line, in the board 1 formed withinjection molding, the bottom wall 6 of the recess 3 including thebottom wall 6 tends to expand toward the outside. Measurements of anexpansion amount 6 show that a maximum thereof is 0.038 mm around thecenter of the wall 6 and a minimum thereof is 0.007 mm around theperipheral thereof. This means that the expansion amount S is suppressedto a negligible amount by using the above-mentioned manufacturing methodwhich uses the slide core 15 moving into the cavity 12 filled withmolten resin to form the bottom wall 6.

FIGS. 8A-8C show modified examples of the recess for mounting. In FIG.5A, a recess 103 for mounting a component is extended to a side 120 of aboard 101 for an IC card where the gate space 14 is provided, so that afirst hole 104 of the recess 103 is open both to the side of the board101 and to the peripheral. Further, a second hole 105 is formed at thebottom of the first hole 104 leaving an adhesion wall 107. In FIG. 8B, arecess 203 is formed like a terrace so as to occupy one of the fourcorners of a board 201 for an IC card. Further, a second hole 205 isformed at the bottom of the first hole 204 leaving an adhesion wall 207.In FIG. 8C, a recess 303 is formed to occupy a whole shorter side of aboard 301 including side S2, and a first hole 304 is formed at theterrace plane. A plurality of second holes 305 is formed at the bottomof the first hole 304 leaving an adhesion wall 307, in contrast to thesecond hole 105 and 205 shown in FIGS. 8A and 8B having similar shapesas the first one.

The first and second holes 4, 5 may have any form such as circle,ellipse or triangle beside square. The second hole 5 may have a shapedifferent from that of the first one 4 according to a shape of acomponent 2 to be mounted. Though the recess 3 comprises the rectangularfirst and second holes 4, 5 in the above-mentioned embodiments, therecess 3 needs not to have such a structure. For example, the secondhole 5 may be omitted and the bottom wall of the first hole 4 is made asa bottom wall 6. Further, the shape of the recesses may be changed to atruncated cone, a truncated pyramid or the like.

The size of the board 1 can be selected in a range of a side along thelongitudinal direction from 84.00 to 86.00 mm, a side perpendicular tothe longitudinal direction from 53.00 to 55.00 mm and a thickness T1 ofthe bottom wall 6 from 0.05 mm to 0.5 mm. If the thickness T1 is lessthan 0.05 mm, it becomes harder to form the bottom wall 6 surely even byusing the abovementioned manufacturing method. On the other hand, if thethickness T1 increases above 0.5 mm, the bottom wall 6 can be formedwithout moving the slide core 15, and the fluidity of the resin is notdamaged even if a protrusion wall in correspondence to the slide core 15is located at the forming position before filling the molten resin. Oneside of the recess 3 along the bottom wall 6 has a length R1, and theadjacent side of the recess 3 along the bottom wall 6 has a length R2,as shown in FIG. 1. Therefore, the area A6 of the bottom wall 6 is equalto the length R1 of the one side multiplied by the length R2 of theother. Stated as an equation, A 6 =R1×R2.

In the embodiment, it is expected to change the area of the bottom wall6 in a wide range between 40.00-1,200.00 mm². This complies with a casewhere a plurality of IC chips are mounted or components 2 such as a filmcell, a display device and/or input/output terminals, in the recesses asshown in FIGS. 8A-8c.

Accordingly, in this example, the area of the main body of the board canrange from 4452 mm² (84.00 mm*53.00 mm) to 4730 mm² (86.00 mm*55.00 mm).Therefore, the ratio of the thickness of the bottom wall of the recess(0.05 mm to 0.5 mm) to the area of the main body of the board (4452 mm²to 4730 mm²) is in the range of 1:95000 (0.05/4730) to 1:8900(0.5/4452). Also, it follows that the ratio of the area of the bottomwall (40 mm² to 1200 mm²) to the area of the main body of the board(4452 mm² to 4730 mm²) is in the range of 0.8% (40/4730) to 27%(1200/4452).

The board 1 can be modified partly as shown in FIG. 9 where two narrowribs 20 protrude to the recess 3 at inner walls of a first hole 4′ ateach shorter side thereof. By using the ribs 20, an IC chip 2 can bemounted or fixed temporarily by pressing it in the first hole 4′. Whenan IC chip 2 is fixed by the ribs 20 temporarily as explained above soas not to be dropped from the recess 5, it can be prevented for the ICchip 2 to be removed under inertia shock such as vibrations, start orstop of a carrier. The IC chip 2 is fixed by filling an adhesive betweenan adhesion wall 7 of the first hole 4′ and the IC chip 2. The positionsand the number of the ribs 20 can be changed so as to be arranged withinthe recess 3, and the shape and the size thereof can also be adaptedaccording to conditions.

In a board 1 shown in FIG. 10, the peripheral 1 a at the front side hasround corners 1 a. A mold for injection molding is formed to havepartial arcs for the round corners 1 a. Because the round corners 1 acan be formed on injection molding, it can be produced at a low cost.The board 1 having round corners is hard to be caught when inserted toor removed from a card reader, or malfunctions such as errors on loadingor injection occur hardly. The round corners 1 a can also be flat smallslant planes formed at edges of the board. It may also be formed only ata pair of longer or shorter sides among the four sides.

As explained above, injection molding is used to manufacture the boardfor an IC card. Therefore, various structures can be added at the outerplanes of the board. For example, in a structure shown in FIG. 11A, aknob 521 is provided at one of the surfaces of the board 501, and asafeguard 521 a having continuous grooves and ridges for preventingsliding can be formed as an integral body with a main body of the board501. In a structure shown in FIG. 11B, a frame 622 is formed along theperipheral of a board 601 for an IC card, and a wall plane surrounded bythe frame 622 is depressed as an adhesion plane 624 for adhering aprotection film 623. In a structure shown in FIG. 11C, a plane wall ofthe board 701 has a depressed portion 725 for embedding a mark 726 of acompany, an emblem for displaying a grade of the card or the like.Though not shown in detail, in these examples, a component 502, 602, 702such as an IC chip is fixed to a recess 503, 603, 703 (not shown) havinga structure similar to the above-mentioned recesses.

The board for an IC card is not needed to be a square. For example, FIG.12 shows a board 801 having a shape of a telephone card. The board 801has a slant side 809 besides shorter and longer sides S1 and S2. In thisexample, the board main body of the 801 has a size of a longer side of80.00-15.00 mm, a shorter side of 50.00-10.00 mm and a thickness T of0.5-0.9 mm. A ratio of a thickness T1 of a bottom wall 806 of a recess803 to an area of the board main body of the 801 is set to be from1/(8.5*10⁴)−1/(3.0*10²).

Accordingly, in this example, the area of the main body of the board canrange from 150 mm² (10.00 mm*15.00 mm) to 4000 mm² (50.00 mm*80.00 mm).Therefore, the ratio of the thickness of the bottom wall of the recess(0.05 mm to 0.5 mm) to the area of the main body of the board (150 mm²to 4000 mm²) is in the range of 1:85000 (0.05/4000) to 1:300 (0.5/150).Also, preferably, the ratio of the area of the bottom wall to the areaof the main body of the board is in the range of 4% to 8%.

The recess 3 for mounting a component does not necessarily have aterrace structure. The second hole 5 may be omitted as shown in FIG. 13.In this case, a hole having a bottom wall is formed, and a part of theinner surface of the hole is used for adhesion of a component. Forexample, the recess 3 may be formed as an upside-down truncated pyramidor cone, and the slopes at the side of the opening is formed as anuneven surface as an adhesion wall 7. The inner wall of the recess 4 maybe formed as a continuous ridge plane, to be used as an adhesion plane7. The uneven plane of the adhesion wall 7 may also be formed as groovesand ridges arranged as a lattice, parallel grooves or ridges, orindependent pits or projections.

The board for IC card shown in FIG. 13 has a shape of character T foruse as a key for locking a door. The board 901 has a length S3 along ashorter side of 30-60 mm and a length S4 along a longer side of 30-60mm. A recess 903 having a bottom wall 906 is provided near an end of theshorter side.

Although the present invention has been fully described in connectionwith the preferred embodiments thereof with reference to theaccompanying drawings, it is to be noted that various changes andmodifications are apparent to those skilled in the art. Such changes andmodifications are to be understood as included within the scope of thepresent invention as defined by the appended claims unless they departtherefrom.

What is claimed is:
 1. A board for an IC card, comprising: a main bodymade of a plastics material, said main body having a shape of a plateformed of said plastics material throughout as an integral one-piecebody, said main body comprising a first plane and a second plane inparallel to each other, said second plane being flat, said main bodyhaving a thickness of 0.5-0.9 mm; and a recess as a space for receivingand adhering a component, said recess having an opening in said firstplane of the main body, said recess having a bottom wall located abovesaid second plane, a side extending from said bottom wall to the firstplane and including an uneven surface for applying an adhesive, and ribsextending from said side of said recess to contact with the component.2. The board according to claim 1, wherein said recess comprises a firsthole and a second hole formed at a base of the first hole, the base ofthe first hole comprising said uneven surface and a base of said secondhole comprises said bottom wall of said recess.
 3. The board accordingto claim 1, wherein said main body has a shape of a rectangular plate ofa longer side of 84.00-86.00 mm, a shorter side of 53.00-55.00 mm, andthe ratio of the thickness of the bottom wall of said recess to the areaof said main body is set in the range of 1:95000 to 1:8900.
 4. The boardaccording to claim 1, wherein the ratio of the area of said bottom wallof said recess to the area of said main body is set in the range of 0.8%to 27%.
 5. The board according to claim 1, wherein at least one edgeamong edges of said first and second planes of said main body has around shape.
 6. The board according to claim 1, wherein said main bodyhas a slanted side.
 7. The board according to claim 6, wherein said mainbody has a longer side of 15.00-80.00 mm, a shorter side of 10.00-50.00mm, and the ratio of the thickness of the bottom of the recess to thearea of the main body of the board is set in the range of 1:85000 to1:300.
 8. The board according to claim 1, wherein said main body has theshape of the letter T.
 9. A board for an IC card, comprising: a mainbody made of a plastics material, said main body having a shape of aplate formed as a unitary body integrated as one body, said main bodycomprising a first plane and a second plane in parallel to each other,said second plane being flat; and a recess as a space for receiving andadhering a component, said recess having an opening in said first planeof the main body, a bottom located above said second plane, a sideextending from said bottom to the first plane and including an unevensurface for applying an adhesive, and ribs extending from said side ofsaid recess to contact with the component, wherein said body has athickness of 0.5-0.9 mm at the bottom of said recess.
 10. A board for anIC card, comprising: a main body having a shape of a plate; a recesshaving a space for receiving and adhering a component, the recess beingformed in one plane of the main body, the recess comprising a bottomwall integrated as one body with the main body; wherein said recesscomprising an adhesion section for adhering the component, a wall ofsaid adhesion section comprising an uneven surface, further comprisingribs extending from an inner side of said recess to contact thecomponent.
 11. The board according to claim 10, said recess comprising afirst hole for receiving a base of the component and a second holeformed at a bottom of the first hole, the bottom of the first holecomprising said adhesion section.
 12. The board according to claim 10,wherein at least one edge among edges at front and back planes of themain body has a rounded shape.
 13. The board according to claim 10,wherein said main body has a shape of a rectangular plate having alonger side of 84.00-86.00 mm, a shorter side of 53.00-55.00 mm and athickness of 0.5-0.9 mm, and the ratio of the thickness of the bottomwall of the recess to the area of the main body of the board is in therange of 1:95000 to 1:8900.
 14. The board according to claim 10, whereinsaid main body has a longer side of 15.00-80.00 mm, a shorter side of10.00-50.00 mm, and a thickness of 0.5-0.9 mm, and the ratio of thethickness of the bottom wall of the recess to the area of the main bodyof the board is in the range of 1:85000 to 1:300.
 15. The boardaccording to claim 10, wherein the ratio of the area of the bottom wallto the area of the main body of the board is in the range of 0.8% to27%.
 16. The board according to claim 10, wherein the ratio of the areaof the bottom wall to the area of the main body of the board is in therange of 4% to 8%.